Caja Minitorre microATX IN-WIN BK644 Negra 300W 1*5e 1*3e 1*3i 2USB+Audio

Small Case Smart Choice + With easy to integrate, flexible design, excellent performances, and advanced Technology, BK Series provides a perfect avenue to boost your margins and increase revenue. Easy Compatible with all standard for desktop components. Easy system integration. Flexible Small but flexible enough to accommodate four full height PCI cards. Excellent Meets 65W 2006 FMB thermal target for Core™ 2 Duo without any case fan. Meets 30 dB(A) or 3.5 BA of system acoustic target in idle mode (Lower processor power, C1E enabled & iQST implemented for Conroe on 965/ICH8 platform). Design Philosophy To design a small 13L SFF chassis with better thermal & acoustic performance than other bigger size chassis. Security + Padlock loop Kensington Slot Optional + IEEE 1394 IR Removable Air Filter Chassis Intrusion Switch Screwless ODD/FDD/HDD Bays Clips Screwless Top Cover Clips Excellent Thermal Solutions + Intel Mt. Jade Ref. Design New Partition Plate Cooling Tech (New PPCT) No 2nd Fan (Rear Fan) Needed Additional ventilation holes on the side panel No Partion-top view Partition Plate-top view No Partion-zoom in Partition Plate-zoom in	Features + New PPCT Excellent Thermal & Acoustic Solution   + New features of the Second generation of PPCT technology include removable air duct and an enlarged adjustable vent various CPU positions.     + No second fan needed.     + Support LGA1156 Socket and downward compatible (LGA775)   Adjustable Partition Plate Cooling Tech accommodates different motherboards and provides the optimal thermal performance. Detachable 5.25” optical drive bracket for easy installation. Standard SFX 12V 250W & 300W power supply platform offers high performance / low power solution. USB 2.0 x 4, HD Audio x 1, IEEE 1394 (Option) Designed to fit standard Micro ATX motherboards for easy system integration. Designed for Digital Home and Digital Office. Supports 4*full height slots for GFX / TV tuner cards. Optional removable air filter. Optional screwless designs-ODD/FDD/HDD bays and top cover clips for easy installation. Meets RoHS, CE and FCC Class B requirements Tool Free + Screwless ODD Bays Clips   Screwless FDD Bays Clips   Screwless HDD Bays Clips   Screwless Top Cover Clips

Case Size	S.F.F Tiny Tower Chassis
Material	0.6mm SECC Japanese ECO Steel
Processor	Support Dual Core and Quad Core Processor
M/B Form Factor	Micro ATX
Drive Bays	External 5.25" x 1, 3.5" x1 Internal 3.5" x 1
Front Ports	USB 2.0 x 4, HD Audio x 1
Power Supply	SFX 12V form factor, 300W
I/O Expansion Slots	Full Height Slots x 4
Dimension(H x W x D) w/o Front Panel	323 x 140 x 276 mm 12.7" x 5.5" x 10.8" (12.5L)
External Drive Bay	5.25" x 1, 3.5" x1
Internal Drive Bay	3.5" x 1
Thermal Solution	Intel Mt. Jade Ref. Design New Partition Plate Cooling Tech (New PPCT) No Second Fan (Rear Fan) Needed
Safety	Meets RoHS, CE and FCC Class B Requirements
Security	Padlock Loop / Kensington Slot
Optional	IEEE 1394 / IR / Removable Air Filter Chassis Intrusion Switch Screwless ODD/FDD/HDD Bays Clips Screwless Top Cover Clips

New Partition Plate Cooling Tech (New PPCT) + Enlarged Vent Removable Air Duct 　 Adjustable Positions ＊The New PPCT Technology supports LGA1156 Socket and downward compatible(LGA775). System Thermal Result +   Cooler Fan Speed 2684 RPM Gfxcard with Active Fansink CPU Core™ 2 Duo E6700 (2.66GHz) Ambient Temperature 35℃ Tcase of CPU 57.22 Ta average 37.16 PSU out 52.19 ICH8 TOP 47.77 MCH 46.49 DIMM 43.79 HDD 49.24 SYSTEM IN 35.00 VGA 46.68 Tcase projected to 65W TDP 58.61 Margin to 60.1C Spec 1.49 Source from Mt. Jade Ref. Design, co-work by In Win and Intel. All examine source are subject to change in anytime, without notice. Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of IN WIN products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance.     Q&A + Heatsink Solution for BK623(Mt Jade) chassis Q. How to select a proper heatsink for Mt. Jade / BK623? A. (1)Use Intel boxed heatsink or (2)Select a Radial-fin heatsink (similar to the boxed fan heatsink solution from Intel).Here is a list of 3rd Party thermal solutions per processor from Intel’s website: ‧Intel® Core™2 3rd party Thermal list: 　www.intel.com/go/thermal_Core2Quad ‧Intel Core2 Duo 3rd party Thermal list: 　www.intel.com/go/thermal_Core2Duo ‧Intel Pentium D 3rd party Thermal list: 　www.intel.com/go/thermal_PentiumD ‧Intel Pentium 4 3rd party Thermal list: 　www.intel.com/go/thermal_Pentium4   Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.

Partition Plate Cooling Tech +               The innovative partition plate cooling technology (PPCT) is the world’s first complete thermal solution co-designed by IN Win and Intel. By separating the CPU fan from the heatsink to reduce back draft, PPCT efficiently streamlines the airflow in a unilateral direction to provide exceptional thermal performance. Partition Plate to Guide Air Flow + Before：Airflow circulates in chassis without partition plate. After：Controlled airflow enhances thermal/acoustic experience. 　 This product is recommended to use with Intel boxed CPU cooler. Better Acoustic Performance System Acoustic <30 dB(A) and 3.5 BA Lower Power – 50% lower TDP All sound power data listed is “Measured LwA” data according to ISO 7779 standard at room temperature of 23°C ±2°C System Acoustic Result +   Sound Power: Maxpower 85% : 4.2 BA Idle : 3.5 BA Sound Pressure: Maxpower 85% : 35 dB (A) Idle : 30 dB (A)

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